Ultrasonic bonding process
US5660319A · kind A · utility
87Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 1995 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Jan 17, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.