Patent · US Expired

Method of manufacturing a metallic component or substrate with bonded coating

US5660320A · kind A · utility

46Cited by
5References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 9, 1995
Grant dateAug 26, 1997
Priority date
Expiry dateNov 9, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/12486
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A metallic alloy part having a bonded coating that includes dispersed hard-material particles embedded in a metal matrix, composed of a eutectic solder whose alloy elements include at least the base metal of the metallic alloy part. The solder is formed by fusion bonding on the metallic alloy part, a precoating composed of sequential layers of the elemental components of the solder applied on the metal part or on the hard-material particles. The composition and disposition of the various layers are graduated such that the melting points of the elemental solder components increase towards the outermost layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.