Method of manufacturing a metallic component or substrate with bonded coating
US5660320A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1995 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Nov 9, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12486
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A metallic alloy part having a bonded coating that includes dispersed hard-material particles embedded in a metal matrix, composed of a eutectic solder whose alloy elements include at least the base metal of the metallic alloy part. The solder is formed by fusion bonding on the metallic alloy part, a precoating composed of sequential layers of the elemental components of the solder applied on the metal part or on the hard-material particles. The composition and disposition of the various layers are graduated such that the melting points of the elemental solder components increase towards the outermost layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.