Method for fabrication of high vertical aspect ratio thin film structures
US5660680A · kind A · utility
128Cited by
11References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 7, 1994 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Mar 7, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24744
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.