Electroplating apparatus
US5660699A · kind A · utility
58Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1996 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Feb 16, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is supplied onto the substrate so that the surface of the substrate is plated. A negative pressure source clamps the substrate by drawing the clamper under a negative pressure through a suction conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.