Sputter coating power processing portion
US5660700A · kind A · utility
47Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1994 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Jul 28, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13439
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 .mu.s to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.