Inter-level dielectrics with low dielectric constants
US5660920A · kind A · utility
9Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1995 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Jul 14, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metallization is coated with a network polymer. The network polymer may be either a cross-linked polyfluorinated polyallylether-polyhydromethylsiloxane copolymer or a network polymer formed from cross-linked fluoromethylene cyanate ester monomers. These polymer networks are resistant to the diffusion of a metallization, such as copper, therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.