Process for manufacturing a plurality of strip lead frame semiconductor devices
US5661086A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1996 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Jan 11, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for producing semiconductor devices comprises a first step in which a plurality of metal substrates each of which is provided with a die mounting region at a central portion thereof are connected in series to produce a train of connected metal substrates by means of first connecting tabs and a pair of first side rails each of which is provided with first positioning pilot apertures are connected to the train by means of second connecting tabs to produce a metal substrate frame, a second step in which a plurality of circuit substrates each of which is provided with a lead pattern around an opening formed at the central portion thereof are connected in series by means of third connecting tabs to produce a train of connected circuit substrates and a pair of second side rails each of which is provided with second positioning pilot apertures are connected by fourth connecting tabs to produce a circuit substrate frame, a third step in which both frames are alinged with each other making use of the first and second positioning pilot apertures and are adhered with each other to produce a die mounting substrate frame, and a fourth step in which a semiconductor die is received in a ca…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.