Substrate for integrated components comprising a thin film and an intermediate film
US5661333A · kind A · utility
25Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1995 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Jan 25, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate for integrated components including a support structure and a thin non-conductive film. An intermediate film is placed between the support structure and the thin non-conductive film. The intermediate film is a sacrificial film which may be removed chemically. By doing so, the thin non-conductive film may be liberated from the support structure. The intermediate film is traversed by channels which carry the chemicals for removing the sacrificial film. The channels may form a grid on the surface of the intermediate film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.