Thermal head
US5661513A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1996 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Sep 24, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3357
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
To realize a high-quality and high-speed printing which can sufficiently comply with high definition, a thermal head having a high heat resistance and excellent thermal responsivity comprises a high thermal conductivity substrate, a heat accumulating layer formed on the surface of the substrate, a plurality of heater elements formed on the surface of the heat accumulating layer in line, a common electrode and an individual electrode energizing each of the heater elements, and a protective layer formed so as to cover the heat accumulating layer, the heater elements and the electrodes, wherein a stress-resistant layer composed of an insulating high-modulus ceramic is provided on the surface of the heat accumulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.