Thermal management system having a thermally conductive sheet and a liquid transporting material
US5661637A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 3, 1996 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | May 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal management system having an enclosure comprising a pair of enclosure regions disposed on opposite surfaces of a flexible thermally conductive sheet. The enclosure regions are coupled together through an aperture provided in the sheet. A liquid transporting material is disposed within the enclosure and passes between the enclosure regions through the aperture. A liquid is disposed on the liquid transporting material. One end portion of the thermally conductive sheet is adapted for thermal coupling to a heat source and the opposite end portion is adapted for thermal coupling to a heat sink. Heat emanating from the heat source passes though the thermally conductive sheet to the liquid to convert the liquid to a vapor. The vapor passes within, and through, the enclosure regions for transportation to the end of the liquid transporting material disposed adjacent the heat sink coupling end of the thermally conductive material. The transported vapor is condensed to the liquid as the vapor transfers its heat through the thermally conductive sheet to the heat sink. The condensed liquid is then transported by capillary action provided by the liquid transporting material back to the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.