Optical module having self-aligned optical element and optical wave-guide by means of bumps on rectangular pads and method of assembling thereof
US5661831A · kind A · utility
10Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1995 |
| Grant date | Aug 26, 1997 |
| Priority date | — |
| Expiry date | Dec 13, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical module has an optical wave-guide structure formed on a silicon substrate and a laser diode array solder bonded to first pads patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.