Thermally stabilized dewar assembly, and its preparation
US5661980A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 1995 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | Jun 6, 2015 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF17C2270/0509
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A dewar assembly has a wall contacting a liquefied gas within the interior of the dewar assembly. The dewar assembly is processed so as to remove the stable gaseous film boiling layer that is normally present between the liquefied gas and the wall. The processing is preferably accomplished by reducing the pressure on the liquefied gas to reduce its temperature and the temperature of the wall, and then returning the pressure over the liquefied gas to ambient to produce a temperature in the liquefied gas which is temporarily greater than that of the wall. The existing gaseous film boiling layer is removed, so that thermal and acoustic variations present in the system due to the presence of the film boiling layer are eliminated, and the liquefied gas attains a more direct contact with the wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.