Fabricating method of a multiple micro-tip field emission device using selective etching of an adhesion layer
US5662815A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1995 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | Jul 31, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multiple micro-tip field emission device is fabricated by forming a titanium adhesion layer under a striped tungsten cathode, etching the tungsten cathode radially using an aluminum mask and selectively etching the titanium adhesion layer, so that multiple micro-tips are formed due to the intrinsic internal stress of the tungsten itself. Thereby, the adjustment of the tip size is optionally available during the process and has excellent reproducibility since the process uses the intrinsic internal stress of the tungsten and the characteristic of a buffered oxide etching (BOE) method. Also, the output current can be controlled in a wide range from nA to mA because of the multiple micro-tips. By forming the tips with tungsten, the device has good strength, oxidation characteristics and work function and has good electrical, chemical and mechanical endurance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.