Low temperature glass paste with high metal to glass ratio
US5663109A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 1996 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | May 29, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C8/24
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis: PA1 about 40-65% Ag.sub.2 O PA1 about 15-35% V.sub.2 O.sub.5 PA1 about 0-30% PbO.sub.2 PA1 about 0-20% TeO.sub.2 The essentially resin-free paste utilizes the glass composition described above and, for a metallized ceramic substrate, has a metal:glass ratio of from about 8:1 up to about 11.5:1. For a bare (nonmetallized) ceramic substrate, the paste has a metal:glass ratio of from about 8:1 up to about 32:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.