Wire bond tape ball grid array package
US5663530A · kind A · utility
54Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1995 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | Aug 1, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.