RF device package for high frequency applications
US5663597A · kind A · utility
32Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1994 |
| Grant date | Sep 2, 1997 |
| Priority date | — |
| Expiry date | Nov 23, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3421
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This is a device package comprising: a leadframe comprising a plurality of leads for effecting circuit connections to the device; and a metal ground piece connected to the leadframe. Other devices and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.