High density termination system with molded-on strain relief frame, and method
US5664964A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1996 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Apr 10, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A termination for a plurality of electrical conductors of a substrate includes a strain relief frame molded to the substrate, a connector housing having a plurality of electrical terminals positioned with respect to the frame to orient the terminals with respect to the conductors, and a plurality of the terminals being electrically connected to respective electrical conductors, the connections being made subsequent to the molding of the strain relief to the substrate. A cable termination assembly made by the process of molding a strain relief to a substrate having plural conductors in positional relation, said molding including leaving exposed connecting portions of respective conductors, subsequently attaching plural terminals respectively to exposed connecting portions of said conductors. A method of making a termination assembly includes molding a strain relief to a substrate having plural conductors in positional relation, said molding including leaving exposed connecting portions of respective conductors, subsequently attaching plural terminals respectively to exposed connecting portions of said conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.