Method for manufacturing a high density electronic circuit assembly
US5665650A · kind A · utility
28Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1996 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | May 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Photoimageable dielectric materials are coated on substrates, selectively exposed and developed, whereby small vias and interconnection openings are formed between adjacently spaced circuit layers. A conductive paste may be used to provide sequential layer interconnection and surface planarization. No adhesives are required in the manufacture of a circuit assembly having multiple circuit and dielectric layers, and the manufacturing method avoids the requirement for drilled through holes and blind vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.