Method for encapsulating an electrochemical sensor
US5665653A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1995 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Mar 29, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electrochemical sensor assembly which allows a solution to make contact with an active sensing area of a sensor, while constraining the solution such that the fluid does not contact the sensor electronics and a method for fabricating such a sensor assembly. A sensor assembly is fabricated in accordance with a simple process, including: fabricating a master pattern which matches the external profile of an epoxy shell which will encapsulate a substrate upon which the sensors are mounted; forming a flexible tool (or mold) which conforms to the general profile of the master pattern; placing sensors together with any other desired electronic circuitry on a substrate (such as a printed circuit board or a ceramic pad to form a "hybrid"); pressing a number of electrical contact points on the hybrid and the active sensing area of each sensor on the substrate into contact with flexible protrusions of the flexible tool; and potting the hybrid. Due to the fact that the protrusions from the flexible tool are in contact with the hybrid and structures thereon, a seal is formed to prevent potting material from contacting and covering the predetermined areas of the hybrid covered by the protrusi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.