Use of tantalum oxide capacitor on ceramic co-fired technology
US5666004A · kind A · utility
32Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1996 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Nov 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package which contains a tantalum oxide capacitor that couples a conductive bottom surface of an integrated circuit to a plurality of conductive lines within the housing of the package. The conductive lines are connected to pins which provide power and ground to the integrated circuit. The pins and conductive lines are also coupled to a number of junctions located on the top surface of the die, by a plurality of wires. The package couples both the top and bottom surfaces of the integrated circuit to the power and ground pins of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.