Method and apparatus for monitoring and controlling the dispensing of materials onto a substrate
US5666325A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 1995 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Jul 31, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/0216
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A dispensing system includes a robot that controls the positional location of a dispenser that dispenses a bead of material, such an adhesive, onto a substrate and wherein a sensor monitors the geometric configuration of the material dispensed. The dispensing system also includes a control circuit which receives information from the sensor so as to monitor geometric characteristics such as height, width and cross sectional area in such a manner that statistical process data can be gathered and also to provide alarm indications whenever the height or width of the bead do not comply with predetermined characteristics. The control circuit also provides a closed loop feedback system so that the supply of material and the nozzle can be controlled in such a manner to modify the flow of bead material whenever a discrepancy or error is detected by the control circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.