Method for producing a cover for an integrated optical circuit and cover for an integrated optical circuit
US5666446A · kind A · utility
8Cited by
10References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 1994 |
| Grant date | Sep 9, 1997 |
| Priority date | — |
| Expiry date | Aug 8, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4245
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for producing a cover for an integrated optical circuit, and an integrated optical circuit produced with this cover. The method minimizes the effort for the integration of optical components into fiber-optic systems by automatically positioning an optical component placed onto a mold punch. A liquid that can harden is poured around the optical component and the mold punch, and after this solidifies, it forms the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.