Patent · US Expired

Method of manufacturing printed circuit boards

US5666722A · kind A · utility

60Cited by

4References

14Claims

0Family size

Assignee

Hewlett-Packard Company, L.P. · US

Inventors

Wilhelm Tamm · Aidlingen, DE
Walter Olbrich · Magstadt, DE
Siegfrid Dippon · Gechingen, DE
Michael Weitmann · Holzgerlingen, DE
Si-Ty Lam · Pleasanton, US

Key dates

Filing date	Mar 15, 1995
Grant date	Sep 16, 1997
Priority date	—
Expiry date	Mar 15, 2015

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49165
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.