Multiple diamond layer polycrystalline diamond composite cutters
US5667028A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1995 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | Aug 22, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P15/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved polycrystalline diamond composite ("PDC") cutter comprising a single or a plurality of secondary PDC cutting surfaces in addition to a primary PDC cutting surface, wherein at least two of the cutting surfaces are non-abutting, resulting in enhanced cutter efficiency and useful life. The primary PDC cutting surface is a PDC layer on one end face of the cutter. The secondary PDC cutting surfaces are formed by sintering and compacting polycrystalline diamond in grooves formed on the cutter body outer surface. The secondary cutting surfaces can have different shapes such as circles, triangles, rectangles, crosses, finger-like shapes, or rings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.