Non-aqueous, adhesive-free method of bonding expanded polymeric parts
US5667621A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1995 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | May 19, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2471/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Bonding of expanded polymeric parts together to produce lost foam molds suitable for casting metallic details is accomplished by applying a non-aqueous, adhesive-free coating comprising a polar, highly dielectric component contained in a liquid vehicle to the interfacing surface of at least one of the parts to be joined. The interfacing surfaces of the parts to be joined are held in contact while the assembly is irradiated with high frequency electromagnetic energy. This energy enables the coating to dielectrically heat the mated expanded polymeric parts until a bond is effected by melting the polymeric parts and inducing expansion of the parts into one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.