Low friction solder electrodeposits
US5667659A · kind A · utility
5Cited by
9References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1996 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | Apr 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a solution and method for plating tin, lead, or tin-lead alloy deposits which contain a co-deposit of fluorocarbon particles to provide a lower-friction solder-type deposit which reduces insertion force and fretting corrosion in separable electronic connectors. The fluorocarbon particles have a size between about 0.1 to 1 .mu.m in diameter, and reduce the coefficient of friction of the resultant deposit to 0.8 or less. Also, the deposit has excellent mechanical properties and can be successfully soldered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.