Wire plating
US5667661A · kind A · utility
13Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 31, 1995 |
| Grant date | Sep 16, 1997 |
| Priority date | — |
| Expiry date | Oct 31, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/48
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method of continuously coating a conductive substrate such as brass wire to produce a desired cross-sectional size of coated material, the wire is drawn through a first die to produce an oversize wire, electroplate in a bath, and then drawn through a final die to reduce its area to the desired size and produce a controlled surface finish. The wire may be cleaned in an acid bath and rinsed in a rinsing bath prior to the electroplating bath. A further rinsing bath and dryer may be interposed upstream of the final die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.