Patent · US Expired

Method for tackless packaging of hot melt adhesive

US5669207A · kind A · utility

19Cited by
15References
2Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJun 23, 1995
Grant dateSep 23, 1997
Priority date
Expiry dateJun 23, 2015

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65B63/08
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

A method of packaging thermoplastic hot melt adhesive compositions in a continuous process. The process is especially suited for hot melt pressure sensitive adhesives to provide convenient handling of such. The process includes the steps of: dispensing a thermoplastic composition into a hollow sleeve of thermoplastic film, wherein said film is submerged in a heat sink bath; sealing the molten thermoplastic composition filled composition; allowing the molten thermoplastic composition to cool and solidify while submerged in the heat sink bath. An apparatus for practicing the process includes: a means for providing a hollow sleeve of thermoplastic film; a dispensing means for filling said hollow sleeve of thermoplastic film with a thermoplastic composition; a heat sink bath adjacent to said dispensing means such that the hollow sleeve of thermoplastic film is submerged in said heat sink bath while being filled; and a means for conveying the filled sleeve of thermoplastic film beneath the surface of the heat sink bath until said filled sleeve has substantially solidified.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.