Ball grid array socket
US5669774A · kind A · utility
Inventor
Key dates
| Filing date | Mar 13, 1996 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Mar 13, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01322
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate mating assembly has a first substrate with at least one socket mounted thereon. The at least one socket has contact retention points provided thereon which extend into a contact receiving opening thereof. A second substrate is provided with at least one mating contact mounted thereon. The at least one mating contact has an arcuate surface and is dimensioned to be received in the contact receiving opening of the at least one socket. As the first substrate and the second substrate are electrically mated together, the at least one mating contact is received in the contact receiving opening and maintained in position therein by the cooperation of the contact retention points with the arcuate surface of the at least one mating contact. The contact retention points are provided on resilient arms which are configured to allow for the elastic distortion thereof as the at least one mating contact is brought into engagement with the at least one socket, such that when the at least one mating contact is fully inserted, the resilient arms will return toward an unstressed position to cooperate with the arcuate surface of the at least one mating contact to maintain the at least one m…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.