Stencil apparatus for applying solder paste
US5669970A · kind A · utility
53Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1995 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Jun 2, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1225
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil including a sheet having holes therethrough in a pattern corresponding to the desired pattern, a smooth upper surface for receiving the solder paste thereon, and a smooth lower surface for contacting the surface of the circuit board, the upper surface having relieved portions so as to increase the friction between the upper surface and the solder paste being squeegeed thereover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.