Apparatus for laser cutting wiring in accordance with a measured size of the wiring
US5670067A · kind A · utility
32Cited by
16References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1994 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | May 5, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/225
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for cutting a wiring on a printed wiring board using a laser beam includes a laser oscillator for emitting a laser beam along a main optical path, a multiaxis positioning apparatus for changing the three-dimensional coordinates of a printed wiring board, an X-Y adjustment apparatus for adjusting two-dimensional coordinates, perpendicular to the main optical path, an apparatus for optically measuring a size of a wiring to be cut, and a control apparatus for controlling beam parameters of the laser beam in accordance with the measured size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.