Lead-frame forming material
US5670293A · kind A · utility
3Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1995 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Mar 10, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/022
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a positive type lead-frame forming material which contains a light-sensitive material comprising an o-quinonediazide compound and a novolak resin, and a positive type lead-frame forming material which contains a positive resist composition comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing a group decomposable by acid which can increase its solubility in an alkaline developer through the action of the acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.