Process of conveying an encapsulated electronic component by engaging an integral resin projection
US5670429A · kind A · utility
29Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1994 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Jun 16, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for manufacturing an encapsulated electronic part having a resin body and an inwardly tapered projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body, The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.