Cool-applied hot melt adhesive composition
US5670566A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 1995 |
| Grant date | Sep 23, 1997 |
| Priority date | — |
| Expiry date | Jan 6, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/26
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A carton, case or tray formed utilizing a hot melt adhesive composition said adhesive consisting essentially of a) 10 to 60% by weight of at least one ethylene n-butyl acrylate copolymer containing 25 to 45% by weight n-butyl acrylate and having a melt index of at least about 850; b) 20 to 60% of a rosin ester tackifying resin; c) 10 to 50% by weight of a microcrystalline or paraffin wax having a melting point of 150.degree. to 200.degree. F.; d) 1 to 20% by weight of a polymeric additive selected from the group consisting of ethylene vinyl acetate containing 10 to 40% by weight vinyl acetate, ethylene methyl acrylate polymers containing 10 to 28% methyl acrylate, ethylene acrylic acid copolymers having an acid number of 25 to 150, polyethylene, polypropylene, poly-(butene-1-co-ethylene), and lower melt index ethylene n-butyl acrylate copolymers; and e) 0 to 1.5% stabilizer, said adhesive characterized by a viscosity of less than 3000 cps at 135.degree. C., fiber tearing bonds from within the range of -35.degree. to 40.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.