Method of manufacturing a hybrid chip card
US5671525A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 4, 1995 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Oct 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a hybrid chip card comprises the steps of providing a card body; forming a cavity in the card body; mounting the electronic module in the cavity of the card body; and connecting an antenna to the electronic module. The cavity opens out on a face of the card body and is adapted for receiving an electronic module. The electronic module includes an integrated circuit chip. The mounting step further includes the step of exposing a plurality of contact pads of the electronic module on the outer surface of the card. The plurality of contact pads permit contact communication between the electronic module and the chip card reader, and the antenna permits contact-free communication between the electronic module and the chip card reader. The hybrid chip card thus manufactured is capable of both contact and contact-free communication with a chip card reader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.