Method of forming a molded pulse oximeter sensor
US5671529A · kind A · utility
104Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A pulse oximeter sensor apparatus which is sealed against liquid penetration during its formation by overmolding, and methods for overmolding. The pulse oximeter sensor apparatus disclosed comprises a preform first section, oximeter sensor components, and an overmolded second section bonded to the preform first section during the overmolding process to form a liquid resistant seal comprising a mechanical bond of overlapping elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.