Method and apparatus for application of liquid materials onto substrates
US5672376A · kind A · utility
10Cited by
7References
33Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 5, 1994 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Jul 5, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2101/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for application of liquid materials onto substrates is provided. The present invention allows high speed selective application of curable liquids to a continuous succession of discrete substrates and subsequent curing of those liquids in order to form a solid or foamed coating on at least a portion of the substrates. The present invention provides increased speed efficiency and adherence of the liquid cured onto the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.