Electronic assembly with semi-crystalline copolymer adhesive
US5672400A · kind A · utility
47Cited by
4References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1995 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Dec 21, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition, preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern on a first substrate to a second circuit pattern on a second substrate. The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.