Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
US5672550A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 1996 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Jan 10, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing semiconductor devices in which a multi-series lead frame that is constructed so as to assemble semiconductor elements in a state that these elements are arrayed in a plurality of series along the longer sides of the lead frame, is set in a mold, and molding resin is injected into cavities of the mold, to thereby form packages for packing the semiconductor elements in a sealing manner. In the method, a resin tablet is positioned so that resin paths are extended at substantially equal lengths to the cavities on the lead frame set in the mold, and the molding resin is injected into the cavities disposed around the resin tablet by pressing the resin tablet with a plunger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.