Method of using an anisotropically conductive material to locate alignment of a semiconductor substrate
US5672979A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 10, 1997 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Jan 10, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for locating electrically conductive features such as device terminals (104) of a semiconductor die device under test (103) includes an array of test terminals (101), an anisotropically conductive material (102) above the array of test terminals (101), and a semiconductor die (103). The array of test terminals has a pitch (203) much smaller than the pitch (204) of the device terminals (104). Individual test terminals (105) of the array of test terminals (101) are scanned to locate the device terminals (104). Once the device terminals (104) are located, the test terminals (105) are configured to send and receive functional signals required for functionally testing the device under test (103).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.