Integrated circuit dual cooling paths and method for constructing same
US5673176A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1995 |
| Grant date | Sep 30, 1997 |
| Priority date | — |
| Expiry date | Dec 6, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal transfer circuit is provided for dissipating thermal energy within a portable minicomputer. The thermal transfer circuit is formed during assembly of the personal computer. Specifically, the thermal transfer circuit embodies dual cooling paths for extracting thermal energy from opposing surfaces of an encapsulated integrated circuit. The dual path thermal transfer circuit is formed by drawing the integrated circuit between an upper path heatsink assembly and a lower path heatsink assembly. Thermal connection of heatsink assemblies to corresponding integrated circuit surfaces, either directly or indirectly, allows enhanced dissipation of power-consumptive integrated circuits, such as modern day CPUs. Clamping of the upper and lower heatsink assemblies occurs in equal and opposite force directions normal to opposed integrated circuit surfaces. The normal clamping forces eliminate application of shear force components upon integrated circuit surfaces and the deleterious effects of surface mount lead dislodgment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.