Discrete packaging system for electronic device
US5673795A · kind A · utility
12Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1995 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Jun 26, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0067
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaging system includes a bottom having a flat surface for accepting an object, a top having a flat surface and projecting fingers extending from the surface of the top. When the top is assembled to the bottom, the fingers deform, forcing the object against the bottom surface. The object is maintained in position by friction against the bottom surface and the presence of undeformed fingers surrounding the object. The packaging system may be made of static dissipative material and include connection claws and rods for connecting a number of packages in series.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.