Packaged integrated accelerometer
US5674258A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1995 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Mar 8, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0828
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are method and apparatus for creating a cantilever accelerometer beam by mechanically forming an accelerometer from a piezoelectric substrate. The inherent structure of the accelerometer provides a means for employing surface mount technology (SMT), or a protective package may be utilized to couple the accelerometer to the hybrid circuit within an implantable pacemaker. The sensor's structure is defined by three members. The first and second members are used to couple the sensor to the hybrid circuit and the third member defines the cantilever accelerometer beam, which generates an electrical output signal indicative of a patient's activity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.