Dry tape covered laser shock peening
US5674328A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 1996 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Apr 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/903
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of laser shock peening a metallic part by firing a laser on a laser shock peening surface of the part which has been adhesively covered by tape having an ablative medium, preferably, a self adhering tape with an adhesive layer on one side of an ablative layer and a confinement medium without flowing a confinement curtain of fluid over the surface upon which the laser beam is firing. Continuous movement is provided between the part and the laser beam while continuously firing the laser beam, which repeatably pulses between relatively constant periods, on a laser shock peening surface of the part. Using a laser beam with sufficient power to vaporize the ablative medium so that the pulses form laser beam spots on the surface and a region having deep compressive residual stresses imparted by the laser shock peening process extending into the part from the surface. The confinement medium may be supplied by a single layer of tape having a clear layer over the ablative layer or a thicker lap or thickness of laps of a tape with just an ablative layer wherein the extra thickness provides the confinement medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.