Semiconductor substrate cleaning process
US5674357A · kind A · utility
21Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 1995 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Aug 30, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02071
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for removing particulate residues from semiconductor substrates. A semiconductor substrate is provided which has upon its surface a particulate residue. At minimum, either the semiconductor substrate or the particulate residue is susceptible to oxidation upon exposure to an oxygen containing plasma. The semiconductor substrate and the particulate residue are exposed to an oxygen plasma. The particulates are then rinsed from the surface of the semiconductor substrate with deionized water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.