Coverlay for printed circuit boards
US5674595A · kind A · utility
55Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1996 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Apr 22, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board having an improved protective coverlay is provided. The product flexible circuit board comprises a flexible, dielectric substrate, one or more electrical conductors carried on the surface thereof, one or more electrical contact bumps in electrical communication with the conductors, and an improved protective coverlay electrically insulating the electrical conductors. The coverlay, which is a solid, tack-free film bonded to the surface of the dielectric substrate, is formed in situ from one or more layers of flexible, dielectric, polymeric adhesives and avoids the use of a pre-formed, self-supporting film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.