Method of applying a photosensitive resin to a substrate for use in papermaking
US5674663A · kind A · utility
Inventors
Key dates
| Filing date | Oct 25, 1996 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Oct 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S162/90
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention comprises a method for applying a curable resin, such as a photosensitive resin, to a substrate such as a papermaker's dewatering felt. The method comprises the steps of providing a substrate; providing a curable liquid resin; providing a second material different from the curable liquid resin; applying the second material to the substrate to occupy at least some of the voids in the substrate intermediate the first and second surfaces of the substrate; applying the curable resin to the substrate; curing at least some of the resin to provide a resin layer on the substrate; and removing at least some of the second material from the substrate, wherein at least some of the second material is removed from the substrate after applying the curable resin to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.