Low molecular weight liquid injection molding resins having a high vinyl content
US5674966A · kind A · utility
30Cited by
24References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1996 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Apr 9, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/80
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Low molecular weight, high alkenyl content silicone resins of the general formula M.sub.y M.sup.vi.sub.z D.sub.a D.sup.vi.sub.b T.sub.c T.sup.vi.sub.d Q or M.sub.y M.sup.vi.sub.z D.sub.a D.sup.vi.sub.b T.sub.c T.sup.vi.sub.d are disclosed, their use in curable liquid injection molding compositions, a process for varying the cure properties of such compositions and articles of manufacture made thereby and therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.