Low-loss, low-inductance interconnect for microcircuits
US5675298A · kind A · utility
12Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 1995 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Nov 21, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low-loss, low-inductance metal interconnect for an electrical signal in a microcircuit comprises a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer. The metal interconnect lines are interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in the plane. The metal interconnect lines together comprise a signal interconnect path, and the metal lines are coupled to a fixed voltage potential, such as ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.