Optical semiconductor array module, method of fabricating the module, and external board mounting structure of the module
US5675685A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1996 |
| Grant date | Oct 7, 1997 |
| Priority date | — |
| Expiry date | Jun 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02469
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical semiconductor array module comprising an optical semiconductor array device constituted by a plurality of semiconductor laser diode, light-emitting diode elements or a plurality of semiconductor photo diode elements, an electronic device for driving and controlling the optical semiconductor array device, a cube-shaped package case for housing the optical semiconductor array device and the electronic device therein, an optical fiber array optically coupled to the optical semiconductor array device, a supporting member for holding and fixing the optical fiber array to one surface of the cube-shaped package case, and a terminal portion having a plurality of pins for electrically connecting an external circuit board to the electronic device. The terminal portion is formed by extending the terminal portion from at least one of surfaces forming the package case, excluding a surface on which the optical semiconductor array device and the electronic device are mounted and a surface opposite to that surface, and the plurality of pins are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array is taken out, where…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.